Improvement for electrical conductivity of Ti3SiC2/Cu joint brazed with a novel Sn6Ag7Ni4Co2Ti low-melting high entropy alloy filler

Xin Nai; Haiyan Chen; Shuai Zhao; Fenjun Liu; Zhikang Shen; Wenya Li

doi:10.1016/j.matlet.2022.132488

Improvement for electrical conductivity of Ti₃SiC₂/Cu joint brazed with a novel Sn₆Ag₇Ni₄Co₂Ti low-melting high entropy alloy filler

Xin Nai
, Haiyan Chen
, Shuai Zhao
, Fenjun Liu
, Zhikang Shen
, Wenya Li

School of Materials Sience and Engineering

Northwestern Polytechnical University Xian
Yulin University

Research output: Contribution to journal › Article › peer-review

8 Scopus citations

Abstract

Reducing the interfacial electrical resistance of Ti₃SiC₂/Cu joint has significant value to promote its application in the field of electrical contact. In the study, a novel Sn₆Ag₇Ni₄Co₂Ti low-melting high entropy alloy (HEA) was designed and fabricated, and a sound Ti₃SiC₂/Cu brazed joint was obtained using above filler. The interface of Ti₃SiC₂/Cu joint brazed with Sn₆Ag₇Ni₄Co₂Ti filler is mainly composed of Ag(s,s), Cu(s,s) and a few (Ni, Co)₂Si. Compared with Ti₃SiC₂/Cu joint brazed with Ag-26.7Cu-4.5Ti filler, the electrical resistance of the joint brazed with Sn₆Ag₇Ni₄Co₂Ti filler is lower at all test temperatures, which is reduced by up to 15.99% when the test temperature is 300 °C.

Original language	English
Article number	132488
Journal	Materials Letters
Volume	322
DOIs	https://doi.org/10.1016/j.matlet.2022.132488
State	Published - 1 Sep 2022

Keywords

Ceramics
Electrical properties
Interfaces
Microstructure
Welding

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10.1016/j.matlet.2022.132488

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@article{41b7e40893fd45faa08cc643b878584d,

title = "Improvement for electrical conductivity of Ti3SiC2/Cu joint brazed with a novel Sn6Ag7Ni4Co2Ti low-melting high entropy alloy filler",

abstract = "Reducing the interfacial electrical resistance of Ti3SiC2/Cu joint has significant value to promote its application in the field of electrical contact. In the study, a novel Sn6Ag7Ni4Co2Ti low-melting high entropy alloy (HEA) was designed and fabricated, and a sound Ti3SiC2/Cu brazed joint was obtained using above filler. The interface of Ti3SiC2/Cu joint brazed with Sn6Ag7Ni4Co2Ti filler is mainly composed of Ag(s,s), Cu(s,s) and a few (Ni, Co)2Si. Compared with Ti3SiC2/Cu joint brazed with Ag-26.7Cu-4.5Ti filler, the electrical resistance of the joint brazed with Sn6Ag7Ni4Co2Ti filler is lower at all test temperatures, which is reduced by up to 15.99\% when the test temperature is 300 °C.",

keywords = "Ceramics, Electrical properties, Interfaces, Microstructure, Welding",

author = "Xin Nai and Haiyan Chen and Shuai Zhao and Fenjun Liu and Zhikang Shen and Wenya Li",

note = "Publisher Copyright: {\textcopyright} 2022 Elsevier B.V.",

year = "2022",

month = sep,

day = "1",

doi = "10.1016/j.matlet.2022.132488",

language = "英语",

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T1 - Improvement for electrical conductivity of Ti3SiC2/Cu joint brazed with a novel Sn6Ag7Ni4Co2Ti low-melting high entropy alloy filler

AU - Nai, Xin

AU - Chen, Haiyan

AU - Zhao, Shuai

AU - Liu, Fenjun

AU - Shen, Zhikang

AU - Li, Wenya

PY - 2022/9/1

Y1 - 2022/9/1

N2 - Reducing the interfacial electrical resistance of Ti3SiC2/Cu joint has significant value to promote its application in the field of electrical contact. In the study, a novel Sn6Ag7Ni4Co2Ti low-melting high entropy alloy (HEA) was designed and fabricated, and a sound Ti3SiC2/Cu brazed joint was obtained using above filler. The interface of Ti3SiC2/Cu joint brazed with Sn6Ag7Ni4Co2Ti filler is mainly composed of Ag(s,s), Cu(s,s) and a few (Ni, Co)2Si. Compared with Ti3SiC2/Cu joint brazed with Ag-26.7Cu-4.5Ti filler, the electrical resistance of the joint brazed with Sn6Ag7Ni4Co2Ti filler is lower at all test temperatures, which is reduced by up to 15.99% when the test temperature is 300 °C.

AB - Reducing the interfacial electrical resistance of Ti3SiC2/Cu joint has significant value to promote its application in the field of electrical contact. In the study, a novel Sn6Ag7Ni4Co2Ti low-melting high entropy alloy (HEA) was designed and fabricated, and a sound Ti3SiC2/Cu brazed joint was obtained using above filler. The interface of Ti3SiC2/Cu joint brazed with Sn6Ag7Ni4Co2Ti filler is mainly composed of Ag(s,s), Cu(s,s) and a few (Ni, Co)2Si. Compared with Ti3SiC2/Cu joint brazed with Ag-26.7Cu-4.5Ti filler, the electrical resistance of the joint brazed with Sn6Ag7Ni4Co2Ti filler is lower at all test temperatures, which is reduced by up to 15.99% when the test temperature is 300 °C.

KW - Ceramics

KW - Electrical properties

KW - Interfaces

KW - Microstructure

KW - Welding

UR - https://www.scopus.com/pages/publications/85130574467

U2 - 10.1016/j.matlet.2022.132488

DO - 10.1016/j.matlet.2022.132488

M3 - 文章

AN - SCOPUS:85130574467

SN - 0167-577X

VL - 322

JO - Materials Letters

JF - Materials Letters

M1 - 132488

ER -

Improvement for electrical conductivity of Ti₃SiC₂/Cu joint brazed with a novel Sn₆Ag₇Ni₄Co₂Ti low-melting high entropy alloy filler

Abstract

Keywords

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