High thermal conductivity of GF@Cu@Ni/Si/Al composites reinforced with Cu and Ni co-deposited graphite flakes

Xiaopeng Han, Ying Huang, Ling Ding, Xiaogang Gao, Zhipeng Xu

Research output: Contribution to journalArticlepeer-review

23 Scopus citations

Abstract

Thermal management of Al composites is a crucial issue to keep the promising performance and excellent reliability of the devices. We revealed a novel method to enhance the surface property of graphite flakes (GF) with Cu and Ni coatings by chemical plating way. Taking advantage of Cu and Ni co-doped GF and silicon powders, the GF@Cu@Ni/Si/Al composites were fabricated by vacuum pressure infiltration method. The GF@Cu-30@Ni-10 composites revealed about 2 times larger TC (474.4 W/m·K) and lower CTE 6.22 ppm/K than neat Al. Our strategy for highly TC offers not only the advanced process for dispersing reinforcements but also an extremely simple way for the anisotropic composites with high TC and low CTE.

Original languageEnglish
Pages (from-to)19191-19197
Number of pages7
JournalCeramics International
Volume46
Issue number11
DOIs
StatePublished - 1 Aug 2020

Keywords

  • Coefficient of thermal expansion
  • Cu
  • Graphite flakes
  • Ni
  • Thermal conductivity

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