High-temperature application of the low-emissivity Au/Ni films on alloys

Zhibin Huang; Wancheng Zhou; Xiufeng Tang; Fa Luo; Dongmei Zhu

doi:10.1016/j.apsusc.2010.04.107

High-temperature application of the low-emissivity Au/Ni films on alloys

Zhibin Huang, Wancheng Zhou, Xiufeng Tang, Fa Luo, Dongmei Zhu

School of Materials Sience and Engineering

Northwestern Polytechnical University Xian

Research output: Contribution to journal › Article › peer-review

52 Scopus citations

Abstract

The 200 nm-thickness Ni film was imposed as the diffusion barrier layer between the Au film and the alloy substrate to improve the low-emissivity durability of the Au film at high temperature. The results show that the Au/Ni multilayer films still kept low emissivity after working at 600 °C for 200 h. It was concluded that the Ni interlayer effectively retarded the diffusion between gold film and the metal alloy below 600 °C.

Original language	English
Pages (from-to)	6893-6898
Number of pages	6
Journal	Applied Surface Science
Volume	256
Issue number	22
DOIs	https://doi.org/10.1016/j.apsusc.2010.04.107
State	Published - 1 Sep 2010

Keywords

Au/Ni multilayer films
Diffusion barrier
High-temperature application
Low emissivity

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abstract = "The 200 nm-thickness Ni film was imposed as the diffusion barrier layer between the Au film and the alloy substrate to improve the low-emissivity durability of the Au film at high temperature. The results show that the Au/Ni multilayer films still kept low emissivity after working at 600 °C for 200 h. It was concluded that the Ni interlayer effectively retarded the diffusion between gold film and the metal alloy below 600 °C.",

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AU - Huang, Zhibin

AU - Zhou, Wancheng

AU - Tang, Xiufeng

AU - Luo, Fa

AU - Zhu, Dongmei

PY - 2010/9/1

Y1 - 2010/9/1

N2 - The 200 nm-thickness Ni film was imposed as the diffusion barrier layer between the Au film and the alloy substrate to improve the low-emissivity durability of the Au film at high temperature. The results show that the Au/Ni multilayer films still kept low emissivity after working at 600 °C for 200 h. It was concluded that the Ni interlayer effectively retarded the diffusion between gold film and the metal alloy below 600 °C.

AB - The 200 nm-thickness Ni film was imposed as the diffusion barrier layer between the Au film and the alloy substrate to improve the low-emissivity durability of the Au film at high temperature. The results show that the Au/Ni multilayer films still kept low emissivity after working at 600 °C for 200 h. It was concluded that the Ni interlayer effectively retarded the diffusion between gold film and the metal alloy below 600 °C.

KW - Au/Ni multilayer films

KW - Diffusion barrier

KW - High-temperature application

KW - Low emissivity

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High-temperature application of the low-emissivity Au/Ni films on alloys

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Keywords

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