Abstract
Cu-Nb-Cu microcomposite reinforced by Nb tube was successfully fabricated by accumulative drawing and bundling process. When the strength of the Cu-Nb-Cu composite reaches above 1 GPa, the conductivity can reach 67% International Annealed Copper Standard (IACS). The annealing effects on the microstructure and properties of the Cu-Nb-Cu microcomposite have been thoroughly discussed. Annealing temperature at 750 °C can lead to an obvious change of microstructures. Both the partial spheroidization and further coarsening of niobium filaments in Cu-Nb-Cu microcomposite have been revealed. The influences of the microstructure changes on the mechanical and electrical properties have also been analyzed.
| Original language | English |
|---|---|
| Article number | 6000205 |
| Journal | IEEE Transactions on Applied Superconductivity |
| Volume | 29 |
| Issue number | 4 |
| DOIs | |
| State | Published - Jun 2019 |
| Externally published | Yes |
Keywords
- Accumulative drawing and bundling (ADB) process
- Cu-Nb-Cu microcomposites
- mechanical properties
- microstructure