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Facile fabrication of PEI/BN/PDA hierarchical structure for boosting tribological performances of carbon fiber/resin composites matched with copper dual disk

  • Northwestern Polytechnical University Xian

Research output: Contribution to journalArticlepeer-review

25 Scopus citations

Abstract

Copper dual disks applied in the braking and transmission of vehicles and aircraft, were susceptible to the damage of shear force and friction heat, seriously affecting friction stability and service life. In this study, enhanced building blocks including polyethyleneimine (PEI), boron nitride (BN) and polydopamine (PDA) were employed to construct a hierarchical interfacial structure for boosting tribological performances of carbon fiber/resin composites paired with copper dual disk. Furthermore, this flexible/rigid/flexible reinforcement contributed to the formation of friction films and high-efficiency thermal conduction network, significantly reducing wear damage to dual disks. The drop in the wear rate of PEI/BN/PDA-modified composite reached 85.07%. Moreover, the wear rate of copper dual disk decreased from 1.63 × 10−8 cm3J−1 to 0.80 × 10−8 cm3J−1, showing a 50.92% decline.

Original languageEnglish
Article number107641
JournalTribology International
Volume172
DOIs
StatePublished - Aug 2022

Keywords

  • Boron nitride
  • Copper dual disk
  • Flexible/rigid/flexible structure
  • Tribological performance

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