Enhanced tensile strength of TiAl/Ti2AlNb diffusion bonding joint by a novel post-bonded hot deformation

Lei Zhu, Xin Wang, Yanglan Chen, Beibei Wei, Guoming Zheng, Zizhao Fan, Juntao Zou, Bin Tang, Jinshan Li

Research output: Contribution to journalArticlepeer-review

6 Scopus citations

Abstract

Dissimilar TiAl-based alloys weld by solid-state bonding, also known as diffusion bonding (DB), usually show brittle intermetallic compounds, high interfacial stress, and poor properties. A novel post-bonded process strategy, slight deformation in the direction of stress parallel to the bonding interface, was developed in the post-bonded treatment of the TiAl/Ti2AlNb joint. The effect of post-bonded processes on the interfacial microstructure, element diffusion, fracture characteristics and mechanical properties were systematically investigated. The results showed that the post-bonded hot deformation (PBHD), compared to the traditional post-bonded heat treatment (PBHT), can effectively increase the major elements diffuse and the growth of the reaction layer, as well as promote the precipitates which distribute uniformly in the reaction layer, finally resulting in superior tensile strength. Compared with the DB samples, the ultimate tensile strength of the PBHD joint increased by 45.58%. In addition, the fracture behavior was further analyzed based on the microfracture morphology and crack propagation path. These findings will facilitate the development of advanced manufacturing processes of blisk for high-temperature light alloys.

Original languageEnglish
Pages (from-to)3598-3605
Number of pages8
JournalJournal of Materials Research and Technology
Volume29
DOIs
StatePublished - 1 Mar 2024

Keywords

  • Interfacial microstructure
  • Post-bonded hot deformation
  • Precipitation
  • Tensile strength
  • TiAl/TiAlNb diffusion bonding joint

Fingerprint

Dive into the research topics of 'Enhanced tensile strength of TiAl/Ti2AlNb diffusion bonding joint by a novel post-bonded hot deformation'. Together they form a unique fingerprint.

Cite this