@inproceedings{5cbe3a9636184766b0b93a02a0d66ab6,
title = "Effect of surface energy on the bond strength of conductive adhesive",
abstract = "Conductive adhesives are considered as one of the promising replacements of the Pb-containing and Pb-free solder alloys. Nevertheless, the delamination failure cause serious reliability issues for the application of conductive adhesives especially under thermal cycling. In this study, the adhesion strength of conductive adhesives is investigated. With the surface energy as the major factor to affect the adhesion strength, the die-attachment samples contaminated by organic or inorganic substances are adopted to measure the surface energy. The adhesion strengths of these samples are further experimentally investigated to explore the mitigation measures. As one of the optimal measures to improve the surface energy, the process by plasma cleaning of the adhesion interface for boxes is utilized to study the influence of surface energy on adhesion strength of die-attachment samples with and without plasma cleaning and with and without thermal test. The underlying mechanism is discussed and some guidance is made for the reliable application of conductive adhesives.",
keywords = "bond strength, conductive adhesive, plasma cleaning, surface energy, thermal test",
author = "Zhenghu Zhu and Jiuhua Xu and Zhixia Yu and Jin Wang and Hairui Wu and Xu Long",
note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 23rd International Conference on Electronic Packaging Technology, ICEPT 2022 ; Conference date: 10-08-2022 Through 13-08-2022",
year = "2022",
doi = "10.1109/ICEPT56209.2022.9873114",
language = "英语",
series = "2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022",
}