Effect of hot pressing on the microstructure and thermoelectric properties of TGZM-grown YbFe-doped CoSb3 skutterudite

  • Xuguang Li
  • , Shuangming Li
  • , Dou Li
  • , Bin Yang
  • , Changjiang Xu
  • , Hong Zhong

Research output: Contribution to journalArticlepeer-review

12 Scopus citations

Abstract

Skutterudites based on CoSb3 are considered potential candidates in thermoelectric applications in the field of mid-temperature power generation. The annealing process necessitates more than a week to complete the peritectic phase transition for traditional melting-quenching-annealing-sintering methods. Herein, a new strategy combining the temperature gradient zone melting process with hot pressing (TGZM-HP) was successfully employed to synthesize YbFe-doped p-type CoSb3 in a shorter time. The resulting samples show enhanced thermoelectric properties compared to TGZM-grown ones, especially in the case of 1 at.% YbFe-doped CoSb3. This compound exhibits a maximal Seebeck coefficient of 166.3 μVK−1 and a power factor of 1.8 mWm−1K−2 at 723 K, showing an increase in these values of 25% and 51%, respectively. Moreover, phonon scattering appears to be enhanced due to the significant reduction in the grain size of the TGZM-HP samples, resulting in a minimum thermal conductivity of 2.71 Wm−1K−1. A dimensionless figure of merit (ZT) of 0.48 was obtained for 1 at.% YbFe-doped CoSb3. This value is 1.6 times larger than that measured for TGZM-grown CoSb3. This work provides an alternative strategy to fabricate skutterudite materials and foster their development.

Original languageEnglish
Pages (from-to)8949-8958
Number of pages10
JournalCeramics International
Volume47
Issue number7
DOIs
StatePublished - 1 Apr 2021

Keywords

  • CoSb
  • Hot processing
  • Temperature gradient zone melting
  • Thermoelectric properties

Fingerprint

Dive into the research topics of 'Effect of hot pressing on the microstructure and thermoelectric properties of TGZM-grown YbFe-doped CoSb3 skutterudite'. Together they form a unique fingerprint.

Cite this