TY - JOUR
T1 - Effect of diamond content on microstructure and properties of diamond/SiC composites prepared by tape-casting and CVI process
AU - Liu, Yongsheng
AU - Hu, Chenghao
AU - Men, Jing
AU - Feng, Wei
AU - Cheng, Laifei
AU - Zhang, Litong
N1 - Publisher Copyright:
© 2015 Elsevier Ltd.
PY - 2015/8/1
Y1 - 2015/8/1
N2 - Diamond particles enhanced SiC composites (diamond/SiC) have been prepared by tape-casting and chemical vapor infiltration (CVI) process. The effect of diamond content (ranging from 50.0 to 63.4vol.%) on microstructure, density, flexural strength, fracture toughness, hardness, thermal conductivity (TC) and coefficient of thermal expansion (CTE) of diamond/SiC composites is discussed. With the increasing diamond content in composites, the flexural strength, fracture toughness, surface hardness, and TC all increased, which of sample S4 (with diamond content 63.4vol.%) could reach up to 431MPa, 4.8MPam1/2, HRA 98.6 (high than HV 50GPa), and 116W/(mK), respectively. The TEM images present a close interfacial combination between diamond and CVI-SiC matrix, and the diamond particle is confirmed to be under compress stress via Raman microspectroscopy technique. Besides, the TC of CVI diamond/SiC composites could be more accurately estimated by a modified model, which is Maxwell 2-EMT (effective medium theory).
AB - Diamond particles enhanced SiC composites (diamond/SiC) have been prepared by tape-casting and chemical vapor infiltration (CVI) process. The effect of diamond content (ranging from 50.0 to 63.4vol.%) on microstructure, density, flexural strength, fracture toughness, hardness, thermal conductivity (TC) and coefficient of thermal expansion (CTE) of diamond/SiC composites is discussed. With the increasing diamond content in composites, the flexural strength, fracture toughness, surface hardness, and TC all increased, which of sample S4 (with diamond content 63.4vol.%) could reach up to 431MPa, 4.8MPam1/2, HRA 98.6 (high than HV 50GPa), and 116W/(mK), respectively. The TEM images present a close interfacial combination between diamond and CVI-SiC matrix, and the diamond particle is confirmed to be under compress stress via Raman microspectroscopy technique. Besides, the TC of CVI diamond/SiC composites could be more accurately estimated by a modified model, which is Maxwell 2-EMT (effective medium theory).
KW - Chemical vapor infiltration (CVI)
KW - Diamond/SiC composites
KW - Model
KW - Stress
KW - Tape-casting
UR - https://www.scopus.com/pages/publications/84925331692
U2 - 10.1016/j.jeurceramsoc.2015.02.009
DO - 10.1016/j.jeurceramsoc.2015.02.009
M3 - 文章
AN - SCOPUS:84925331692
SN - 0955-2219
VL - 35
SP - 2233
EP - 2242
JO - Journal of the European Ceramic Society
JF - Journal of the European Ceramic Society
IS - 8
ER -