TY - JOUR
T1 - Editorial
T2 - Advanced electronic packaging materials: Constitutive model, simulation, design and reliability
AU - Su, Yutai
PY - 2025
Y1 - 2025
KW - advanced electronic packaging
KW - constitutive modeling
KW - diamond/copper composites
KW - multiscale simulation
KW - reliability evaluation
UR - https://www.scopus.com/pages/publications/105020586392
U2 - 10.3389/fmats.2025.1702323
DO - 10.3389/fmats.2025.1702323
M3 - 社论
AN - SCOPUS:105020586392
SN - 2296-8016
VL - 12
JO - Frontiers in Materials
JF - Frontiers in Materials
M1 - 1702323
ER -