@inproceedings{4a17344e033044028f0b6eb79065a91a,
title = "Dynamic response of interconnects in board-level packaging structure at extremely high strain rates",
abstract = "To more accurately characterize the dynamic behavior during impact, the dynamic response of SAC305 lead-free solder and epoxy molding compound (EMC) under high strain rates was investigated. An improved Johnson–Cook constitutive model was employed to describe the constitutive behavior of SAC305 solder. The improved Johnson–Cook constitutive model characterizes the transition effect of strain rate by incorporating a parabolic function into the original constitutive framework. Given the significant rate dependence of EMC under high strain rates, a nonlinear thermoviscoelastic ZWT constitutive model was utilized to elucidate the complex deformation mechanisms. Based on the proposed high strain rate constitutive models, the integration of multiple constitutive models was achieved for the mechanical response evaluation of the complete ball grid array (BGA) packaging structure model during the impact process.",
keywords = "Board-level electronic packaging structure, High strain-rate constitutive model, Interconnection material",
author = "Xu Long and Yuntao Hu and Hongbin Shi and Yutai Su",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 26th Electronics Packaging Technology Conference, EPTC 2024 ; Conference date: 03-12-2024 Through 06-12-2024",
year = "2024",
doi = "10.1109/EPTC62800.2024.10909943",
language = "英语",
series = "Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "887--891",
editor = "Sunmi Shin and Toh, {Chin Hock} and Lim, {Yeow Kheng} and Vivek Chidambaram and Chui, {King Jien}",
booktitle = "Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024",
}