Abstract
A TC17 titanium (Ti) alloy, with and without surface nanocrystallization (SN) treatment was joined to another Ti alloy, TC4, via solid-state diffusion bonding. The interfacial void shrinkage of SN-TC17/TC4 bond was accelerated comparing with that of coarse-grained TC17/TC4 bond. Dynamic recovery and recrystallization were mainly responsible for the fiber texture in β phase and the random orientation in α phase on SN-TC17 side, respectively. The promoted grain growth effect on SN-TC17 side at 1093 K contributed to the disappearance of original bond line (BL). The shear strength of SN-TC17/TC4 bond increased as bonding temperature increased to 1013 K due to the enhanced void shrinkage process, which further increased up to 789 MPa at 1093 K as a result of the disappearance of original BL. Moreover, the shear strength of SN-TC17/TC4 bond at 1093 K was about 60 MPa higher than that of TC17/TC4 bond due to the disappearance of original BL and the Hall–Petch strengthening effect.
| Original language | English |
|---|---|
| Pages (from-to) | 1274-1288 |
| Number of pages | 15 |
| Journal | Journal of Materials Research and Technology |
| Volume | 17 |
| DOIs | |
| State | Published - 1 Mar 2022 |
Keywords
- Dissimilar titanium bond
- Interfacial void
- Microstructure
- Shear strength
- Surface nanocrystallization