Diffusion bonding between Zr-based metallic glass and copper

The diffusion bonding capability between Zr_41.25Ti_13.75Cu_12.5Ni₁₀Be_22.5 bulk metallic glass and pure Cu with and without interlayer was studied on a Gleeble3500 thermomechanical simulator. Experimental results show that good diffusion bonding joints without cracks and voids can be obtained under both conditions. Atomic diffusion at the interface is obviously observed using EDS and EPMA methods, while the diffusion zones are very narrow. The crystalline phases transformed from amorphous state will accelerate the atomic diffusion at the interface.