Dielectric thermally conductive boron nitride/polyimide composites with outstanding thermal stabilities via in-situ polymerization-electrospinning-hot press method

Junwei Gu; Zhaoyuan Lv; Yalan Wu; Yongqiang Guo; Lidong Tian; Hua Qiu; Wanzheng Li; Qiuyu Zhang

doi:10.1016/j.compositesa.2016.12.014

Dielectric thermally conductive boron nitride/polyimide composites with outstanding thermal stabilities via in-situ polymerization-electrospinning-hot press method

Junwei Gu
, Zhaoyuan Lv
, Yalan Wu
, Yongqiang Guo
, Lidong Tian
, Hua Qiu
, Wanzheng Li
, Qiuyu Zhang

School of Chemistry and Chemical Engineering

Northwestern Polytechnical University Xian
PLA 323 Hospital

Research output: Contribution to journal › Article › peer-review

417 Scopus citations

Abstract

Micrometer boron nitride/polyamide acid (mBN/PAA) compound was firstly fabricated via in-situ polymerization, performed to obtain the mBN/PAA electrospun fibers by electrospinning technology, finally to fabricate the dielectric thermally conductive mBN/polyimide (mBN/PI) composites via thermal-imidization followed by hot press method. The obtained mBN/PI composite with 30 wt% mBN presents relatively highly thermally conductive coefficient (λ), excellent dielectric constant (ε) & dielectric loss tangent (tan δ), and extremely outstanding thermal stability, λ of 0.696 W/m K, ε of 3.77, tan δ of 0.007, T_{Heat-resistance index} (T_HRI) of 279 °C and glass transition temperature (T_g) of 240 °C, which presents a great potential for packaging in integration and miniaturization of microelectronic devices.

Original language	English
Pages (from-to)	209-216
Number of pages	8
Journal	Composites Part A: Applied Science and Manufacturing
Volume	94
DOIs	https://doi.org/10.1016/j.compositesa.2016.12.014
State	Published - 1 Mar 2017

Keywords

A. Polymer-matrix composites (PMCs)
B. Thermal properties
C. Electrospinning
D. Compression moulding

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10.1016/j.compositesa.2016.12.014

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@article{0c5d3f6ad625426a95e44f7729595dea,

title = "Dielectric thermally conductive boron nitride/polyimide composites with outstanding thermal stabilities via in-situ polymerization-electrospinning-hot press method",

abstract = "Micrometer boron nitride/polyamide acid (mBN/PAA) compound was firstly fabricated via in-situ polymerization, performed to obtain the mBN/PAA electrospun fibers by electrospinning technology, finally to fabricate the dielectric thermally conductive mBN/polyimide (mBN/PI) composites via thermal-imidization followed by hot press method. The obtained mBN/PI composite with 30 wt\% mBN presents relatively highly thermally conductive coefficient (λ), excellent dielectric constant (ε) \& dielectric loss tangent (tan δ), and extremely outstanding thermal stability, λ of 0.696 W/m K, ε of 3.77, tan δ of 0.007, THeat-resistance index (THRI) of 279 °C and glass transition temperature (Tg) of 240 °C, which presents a great potential for packaging in integration and miniaturization of microelectronic devices.",

keywords = "A. Polymer-matrix composites (PMCs), B. Thermal properties, C. Electrospinning, D. Compression moulding",

author = "Junwei Gu and Zhaoyuan Lv and Yalan Wu and Yongqiang Guo and Lidong Tian and Hua Qiu and Wanzheng Li and Qiuyu Zhang",

note = "Publisher Copyright: {\textcopyright} 2016 Elsevier Ltd",

year = "2017",

month = mar,

day = "1",

doi = "10.1016/j.compositesa.2016.12.014",

language = "英语",

volume = "94",

pages = "209--216",

journal = "Composites Part A: Applied Science and Manufacturing",

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TY - JOUR

T1 - Dielectric thermally conductive boron nitride/polyimide composites with outstanding thermal stabilities via in-situ polymerization-electrospinning-hot press method

AU - Gu, Junwei

AU - Lv, Zhaoyuan

AU - Wu, Yalan

AU - Guo, Yongqiang

AU - Tian, Lidong

AU - Qiu, Hua

AU - Li, Wanzheng

AU - Zhang, Qiuyu

PY - 2017/3/1

Y1 - 2017/3/1

N2 - Micrometer boron nitride/polyamide acid (mBN/PAA) compound was firstly fabricated via in-situ polymerization, performed to obtain the mBN/PAA electrospun fibers by electrospinning technology, finally to fabricate the dielectric thermally conductive mBN/polyimide (mBN/PI) composites via thermal-imidization followed by hot press method. The obtained mBN/PI composite with 30 wt% mBN presents relatively highly thermally conductive coefficient (λ), excellent dielectric constant (ε) & dielectric loss tangent (tan δ), and extremely outstanding thermal stability, λ of 0.696 W/m K, ε of 3.77, tan δ of 0.007, THeat-resistance index (THRI) of 279 °C and glass transition temperature (Tg) of 240 °C, which presents a great potential for packaging in integration and miniaturization of microelectronic devices.

AB - Micrometer boron nitride/polyamide acid (mBN/PAA) compound was firstly fabricated via in-situ polymerization, performed to obtain the mBN/PAA electrospun fibers by electrospinning technology, finally to fabricate the dielectric thermally conductive mBN/polyimide (mBN/PI) composites via thermal-imidization followed by hot press method. The obtained mBN/PI composite with 30 wt% mBN presents relatively highly thermally conductive coefficient (λ), excellent dielectric constant (ε) & dielectric loss tangent (tan δ), and extremely outstanding thermal stability, λ of 0.696 W/m K, ε of 3.77, tan δ of 0.007, THeat-resistance index (THRI) of 279 °C and glass transition temperature (Tg) of 240 °C, which presents a great potential for packaging in integration and miniaturization of microelectronic devices.

KW - A. Polymer-matrix composites (PMCs)

KW - B. Thermal properties

KW - C. Electrospinning

KW - D. Compression moulding

UR - https://www.scopus.com/pages/publications/85007304599

U2 - 10.1016/j.compositesa.2016.12.014

DO - 10.1016/j.compositesa.2016.12.014

M3 - 文章

AN - SCOPUS:85007304599

SN - 1359-835X

VL - 94

SP - 209

EP - 216

JO - Composites Part A: Applied Science and Manufacturing

JF - Composites Part A: Applied Science and Manufacturing

ER -

Dielectric thermally conductive boron nitride/polyimide composites with outstanding thermal stabilities via in-situ polymerization-electrospinning-hot press method

Abstract

Keywords

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