Design and simulation of a valveless piezoelectric micropump for micro cooling system

Thermal management has become a crucial issue in microelectronics due to the ongoing trend of electronic component shrinking. In this work, a piezoelectric micropump with a straightforward construction, small size, and good damage resistance is presented as a solution to the heat dissipation problems of small components. In order to study the deformation behavior of the piezoelectric vibrator and the flow properties of the micropump, a theoretical model of the suggested micropump was created and numerical simulations were carried out using finite element analysis software. The impacts of important influencing elements on vibrator deformation and flow performance were methodically examined using parametric research. The revised design meets the power needs of micro-cooling systems by achieving considerably increased flow output while preserving structural simplicity for easy construction.