Correlation Analysis Between Porosity and Mechanical Properties of Porous Sintered Nanosilver Based on Indentation Response

Sintered nanosilver has become a popular research topic in the electronics packaging industry due to its advantage of low-temperature sintering and high-temperature working capacity. However, the relationship between the microporous structure of sintered nanosilver materials and their macroscopic mechanical properties has not been fully explored. In this study, load–displacement curves of porous sintered nanosilver materials were obtained through indentation experiments. Finite element simulation was then applied to sintered nanosilver materials with different porosities to understand the impact of porosity on their mechanical properties. Using a two-dimensional axisymmetric indentation model based on the finite element method, sintered nanosilver with a porosity of 10% was indented to a depth of 10 μm. The sintered nanosilver matrix model had dimensions of 0.25 mm × 0.25 mm. Simulations were carried out on sintered nanosilver with porosities of 10, 20, 25, and 30%. Indentation curves and stress–strain curves were obtained for each porosity. The mechanical properties of the materials, such as Young’s modulus and yield strength, were analyzed using indentation curves. The results show that the Young’s modulus and yield strength gradually decrease with increasing porosity of the sintered nanosilver material. This study has successfully explained the correlation between the elastoplastic mechanical properties and the indentation response of sintered nanosilver materials with different porosities. In addition, this paper discusses the relationship between the mechanical properties and porous structure of sintered nanosilver materials in detail, providing a more comprehensive experimental basis and theoretical support for research and practical application in high-power electronic devices.