Convective heat transfer of parallel-flow and counter-flow double-layer microchannel heat sinks in staggered arrangement

Han Shen, Yingchun Zhang, Hongbin Yan, Bengt Sunden, Gongnan Xie

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

Previous research has proved Double-layer Microchannel Heat Sinks (MHSs) to be efficient ways to improve the cooling performance of electronic devices. However, the cooling potential of the upper working liquid cannot be fully utilized to cool down the substrate with the heated elements. In this sense, a concept of staggered double-layer MHS is proposed and designed. The parallel and counter flow directions are considered to investigate the flow arrangement effect. The Reynolds number effect, Nusselt number and pressure drop are analyzed in detail and compared with those of a parallel straight double-layer MHS. It is found that the staggered double-layer MHSs exhibit much better heat transfer enhancement and overall thermal performance compared with the parallel straight double-layer MHS. For the staggered double-layer MHSs, the counter flow case is superior to the parallel flow case. This research provides a new structure design to enhance the heat transfer in microchannel heat sinks and broad application prospects for heat sinks in the thermal management of high power density electronic devices.

Original languageEnglish
Title of host publicationHeat Transfer and Thermal Engineering
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Electronic)9780791858431
DOIs
StatePublished - 2017
EventASME 2017 International Mechanical Engineering Congress and Exposition, IMECE 2017 - Tampa, United States
Duration: 3 Nov 20179 Nov 2017

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume8

Conference

ConferenceASME 2017 International Mechanical Engineering Congress and Exposition, IMECE 2017
Country/TerritoryUnited States
CityTampa
Period3/11/179/11/17

Keywords

  • Flow Directions
  • Heat Sinks
  • Staggered Double-Layer Microchannels
  • Thermal Performance

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