Compressive Experimental Analysis and Constitutive Model of Sintered Nano-Silver

Aiming at the potential high-temperature packaging material of the wide band gap semiconductors, experimental and theoretical analysis on the compressive properties of sintered nano-silver was performed. The viscoplastic properties of sintered nano-silver were investigated by compressive experiments with five loading rates, and the effects of loading rate on the ultimate strength and elastic modulus of sintered nano-silver were analyzed. According to the microstructure characteristics of sintered nano-silver, the damage framework including void volume fraction was developed by extending the Gurson-Tvergaard-Needleman model, and the mathematical model between Bonora damage law and void volume fraction was proposed, in which the internal void was assumed to be sphere and cube. A modified constitutive model including the damage model was developed based on the unified creep and plasticity theory for describing the compressive properties of sintered nano-silver. The accuracy of the proposed model was verified by comparing it with the experimental data.