Cellular spacing selection of Cu-Mn alloy under ultrahigh temperature gradient and rapid solidification condition

S. Yang; Y. P. Su; Z. X. Liu; W. D. Huang; Y. H. Zhou

Cellular spacing selection of Cu-Mn alloy under ultrahigh temperature gradient and rapid solidification condition

S. Yang
, Y. P. Su
, Z. X. Liu
, W. D. Huang
, Y. H. Zhou

School of Materials Sience and Engineering

Northwestern Polytechnical University Xian

Research output: Contribution to journal › Article › peer-review

Abstract

Cellular spacing selection of Cu-27.3 wt pct Mn alloy has been investigated by laser surface rapid resolidification experiments. The experimental results show that there exists a wide distribution range in cellular spacing under ultra-high temperature gradient and rapid solidification conditions and the average spacing decreases with the increase of growth rate. The experimental results are compared with the current KGT model for rapid cellular/dendritic growth, and a reasonable agreement is found.

Original language	English
Pages (from-to)	85-86
Number of pages	2
Journal	Journal of Materials Science and Technology
Volume	17
Issue number	1
State	Published - Jan 2001

Cite this

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title = "Cellular spacing selection of Cu-Mn alloy under ultrahigh temperature gradient and rapid solidification condition",

abstract = "Cellular spacing selection of Cu-27.3 wt pct Mn alloy has been investigated by laser surface rapid resolidification experiments. The experimental results show that there exists a wide distribution range in cellular spacing under ultra-high temperature gradient and rapid solidification conditions and the average spacing decreases with the increase of growth rate. The experimental results are compared with the current KGT model for rapid cellular/dendritic growth, and a reasonable agreement is found.",

author = "S. Yang and Su, \{Y. P.\} and Liu, \{Z. X.\} and Huang, \{W. D.\} and Zhou, \{Y. H.\}",

year = "2001",

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T1 - Cellular spacing selection of Cu-Mn alloy under ultrahigh temperature gradient and rapid solidification condition

AU - Yang, S.

AU - Su, Y. P.

AU - Liu, Z. X.

AU - Huang, W. D.

AU - Zhou, Y. H.

PY - 2001/1

Y1 - 2001/1

N2 - Cellular spacing selection of Cu-27.3 wt pct Mn alloy has been investigated by laser surface rapid resolidification experiments. The experimental results show that there exists a wide distribution range in cellular spacing under ultra-high temperature gradient and rapid solidification conditions and the average spacing decreases with the increase of growth rate. The experimental results are compared with the current KGT model for rapid cellular/dendritic growth, and a reasonable agreement is found.

AB - Cellular spacing selection of Cu-27.3 wt pct Mn alloy has been investigated by laser surface rapid resolidification experiments. The experimental results show that there exists a wide distribution range in cellular spacing under ultra-high temperature gradient and rapid solidification conditions and the average spacing decreases with the increase of growth rate. The experimental results are compared with the current KGT model for rapid cellular/dendritic growth, and a reasonable agreement is found.

UR - https://www.scopus.com/pages/publications/0034784053

M3 - 文章

AN - SCOPUS:0034784053

SN - 1005-0302

VL - 17

SP - 85

EP - 86

JO - Journal of Materials Science and Technology

JF - Journal of Materials Science and Technology

IS - 1

ER -

Cellular spacing selection of Cu-Mn alloy under ultrahigh temperature gradient and rapid solidification condition

Abstract

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