Skip to main navigation Skip to search Skip to main content

Bonding adhesive damage study of the secondary cocure reinforcement tensile experiment

  • Yi Wang
  • , Xianzhang Feng
  • , Lei Li
  • , Fusheng Wang
  • Northwestern Polytechnical University Xian
  • Zhengzhou University of Aeronautics

Research output: Contribution to journalArticlepeer-review

5 Scopus citations

Abstract

The bonding adhesive dehiscence is the primary structure failure is in the tensile static test of the secondary cocure reinforcement of laminates. The damage study about the reinforcement structure of the finite element model (FEM) is consist of laminates damage and the adhesive bonding layer damage. Four different damage criterions are used during damage evolution and predicted failure loading of the adhesive bonding layer. The first adhesive bonding layer damage loading is only about 32.8 percent of the last failure of structure and the failure loading of adhensive bonding layer is also less than the last failure of structure. The first damage and last failure position of structure is located in the layer which connected with the bonding layer, and this damage is the direct remote of the structure failure.

Original languageEnglish
Pages (from-to)862-867
Number of pages6
JournalJixie Qiangdu/Journal of Mechanical Strength
Volume34
Issue number6
StatePublished - Dec 2012

Keywords

  • Damage
  • Fracture
  • Laminates
  • Secondary cocure reinforcement
  • The adhesive banding layer

Fingerprint

Dive into the research topics of 'Bonding adhesive damage study of the secondary cocure reinforcement tensile experiment'. Together they form a unique fingerprint.

Cite this