Abstract
A model has been proposed for describing the solidification of undercooled metallic melts, on the basis that the solidification is considered as the sum of a liquid/solid cooling process without latent heat release and a latent heat releasing process without cooling. Application of the model to undercooled solidification of nickel, cobalt, zirconium, and Al-11.3Si-2Cu-0.4Fe alloy samples shows good fits to the temperature curves, and the fitting results of solid fraction curves are consistent with that from the available methods.
| Original language | English |
|---|---|
| Pages (from-to) | 273-280 |
| Number of pages | 8 |
| Journal | Journal of Thermal Analysis and Calorimetry |
| Volume | 119 |
| Issue number | 1 |
| DOIs | |
| State | Published - Jan 2015 |
Keywords
- Cooling curve
- Recalescence
- Solidification
- Undercooling
Fingerprint
Dive into the research topics of 'An analytical model for solidification of undercooled metallic melts'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver