Abstract
The effects of different solution methods on aging microstructure and properties of Cu-Cr-Sn-Zn alloy have been studied. The grain size of rapid solidification is much smaller than solid-solution grain size. Strengthening of smaller grain size is obvious. There are much more fine precipitates in the rapidly solidified aging than in the solid-solution aging which accounts for the increase in hardness and conductivity of Cu-Cr-Sn-Zn alloy. Under 920 °C for 1 h solid solution and 500 °C aging for 15 min, the hardness and electrical conductivity can reach 102 HV and 51.4%IACS, respectively. On rapid solidification and the same aging condition, the hardness and electrical conductivity can reach 178 HV and 60.6%IACS, respectively.
| Original language | English |
|---|---|
| Pages (from-to) | 366-369 |
| Number of pages | 4 |
| Journal | Journal of Materials Processing Technology |
| Volume | 205 |
| Issue number | 1-3 |
| DOIs | |
| State | Published - 26 Aug 2008 |
Keywords
- Cu-Cr-Sn-Zn alloy
- Microstructure
- Properties
- Rapidly solidified aging
- Solid-solution aging
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