TY - GEN
T1 - Aging effect on defect evolution and shear strength of nano-silver solder joint
AU - Gong, He
AU - Yao, Yao
AU - Wang, Jundong
AU - Wang, Shaobin
AU - Long, Xu
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/10/2
Y1 - 2018/10/2
N2 - This paper focus on investigating the aging effect on defect evolution and shear strength of nano-silver solder joint. The thermal aging experiments and uniaxial shear experiments were conducted on 7 groups of articulated sintered nano-silver shear specimens. The test conditions were: a) aging temperature is room temperature, 50°C, 150°C, and 275°C respectively, and aged for 24h; b) aging temperature is 275°C for 24h, 48h, 72h, and 96h, respectively. As the increase of aging temperature and time, the mean shear strength decreases gradually, and the fracture form converts from the nano-silver interlayer fracture to the copper substrate-nano-silver layer interface fracture. In this paper, the corresponding fracture section and evolution of different defects were analyzed. Furthermore, the extended Weibull model, which considers the aging effect on failure of joint, was proposed to analyze the mean shear strength.
AB - This paper focus on investigating the aging effect on defect evolution and shear strength of nano-silver solder joint. The thermal aging experiments and uniaxial shear experiments were conducted on 7 groups of articulated sintered nano-silver shear specimens. The test conditions were: a) aging temperature is room temperature, 50°C, 150°C, and 275°C respectively, and aged for 24h; b) aging temperature is 275°C for 24h, 48h, 72h, and 96h, respectively. As the increase of aging temperature and time, the mean shear strength decreases gradually, and the fracture form converts from the nano-silver interlayer fracture to the copper substrate-nano-silver layer interface fracture. In this paper, the corresponding fracture section and evolution of different defects were analyzed. Furthermore, the extended Weibull model, which considers the aging effect on failure of joint, was proposed to analyze the mean shear strength.
KW - extended Weibull model
KW - nano-silver paste
KW - shear strength
KW - thermal aging
UR - https://www.scopus.com/pages/publications/85056399544
U2 - 10.1109/ICEPT.2018.8480660
DO - 10.1109/ICEPT.2018.8480660
M3 - 会议稿件
AN - SCOPUS:85056399544
T3 - Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
SP - 867
EP - 871
BT - Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
A2 - Xiao, Fei
A2 - Wang, Jun
A2 - Chen, Lin
A2 - Ye, Tianchun
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 19th International Conference on Electronic Packaging Technology, ICEPT 2018
Y2 - 8 August 2018 through 11 August 2018
ER -