A Transition from Fine to Coarse Lamellar Eutectics in the Undercooled Ni-29.8 At. Pct Si Eutectic Alloy: Experiments and Modeling

In contrast to the classical eutectic growth models, according to which the eutectic spacing decreases invariably with undercooling, an anomalous transition from fine to coarse lamellar eutectics was found in the undercooled Ni-29.8 at. pct Si eutectic alloy. In this study, the growth kinetics, recalescence processes, and grain orientations were analyzed. A sharp increase of the growth velocity at an undercooling of about 100 K was found. The recalescence front transited in sequence from a diffuse one with tips, to a diffuse one without tips and then to a sharp one. The microstructures changed from a mixture of directional rod-shaped γ-Ni ₃₁ Si ₁₂ grains and fine lamellar eutectics to solely coarse lamellar eutectics. Coarse lamellar eutectics were found to be formed by rapid solidification of primary directional rod-shaped Ni ₃₁ Si ₁₂ intermetallic compound and subsequent epitaxial growth of secondary Ni ₂ Si intermetallic compound, being consistent with the predictions of eutectic–dendritic and dendritic growth models. Coarse anomalous eutectics at low undercooling were formed by fragmentation of fine lamellar eutectics and their subsequent coarsening. At high undercooling, they were formed by decoupled-eutectic growth.