@inproceedings{206ae9ce730646a39276d9bedde931a8,
title = "A Novel Design Method for a Miniaturized Vertical Interconnection TSV Structure",
abstract = "This paper presents the RF TSV transmission structure with a diameter of 500 micrometers. Through simulation and optimization, a miniaturized vertically interconnected TSV structure is finally designed. Experiments and simulation results confirm the effectiveness and potential application prospects of the new structure. The novel TSV structure presented in this study demonstrates significant potential for enhancing transmission efficiency and reducing occupied space, promising widespread adoption in various advanced technological applications.",
keywords = "miniaturization and high integration, RF, Through-Silicon Via (TSV)",
author = "Yihao Xia and Qingyu Kong and Zeyuan Chen and Zhongpeng Liu and Yanhong Gao and Dongbo Chen and Shigang Zhou and Xilong Lu",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 7th IEEE International Conference on Electronic Information and Communication Technology, ICEICT 2024 ; Conference date: 31-07-2024 Through 02-08-2024",
year = "2024",
doi = "10.1109/ICEICT61637.2024.10671070",
language = "英语",
series = "2024 IEEE 7th International Conference on Electronic Information and Communication Technology, ICEICT 2024",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "446--448",
booktitle = "2024 IEEE 7th International Conference on Electronic Information and Communication Technology, ICEICT 2024",
}