A novel assembly method for 3-dimensional microelectrode array with micro-drive

Ming Hao Wang; Bo Wen Ji; Xiao Wei Gu; Zhe Jun Guo; Xiao Lin Wang; Bin Yang; Cheng Yu Li; Jing Quan Liu

doi:10.1016/j.snb.2018.02.147

A novel assembly method for 3-dimensional microelectrode array with micro-drive

Ming Hao Wang, Bo Wen Ji, Xiao Wei Gu, Zhe Jun Guo, Xiao Lin Wang, Bin Yang, Cheng Yu Li, Jing Quan Liu

Research output: Contribution to journal › Article › peer-review

20 Scopus citations

Abstract

This paper reports a novel assembly method for 3-dimensional (3D) microelectrode array with the aid of anisotropic conductive film (ACF). For this purpose, a unique silicon probe with trenches encircled bonding pads was fabricated to realize the ACF-bonding with flexible cable. This design is meaningful because it can realize planar bonding for subsequently convenient 3D stacking and the time-consuming plating is not needed to form bumping on pads. The reliability of the ACF-bonding is demonstrated by measuring the electrochemical impedance spectra (EIS) of the bonded probes with different structural and dimensional bonding pads. The bonded probes are further assembled into 3D arrays and integrated with micro-drive for chronic neural recordings. The excellent recording performance indicates that the ACF-bonded probes are reliable and suitable for chronic neural recordings.

Original language	English
Pages (from-to)	100-109
Number of pages	10
Journal	Sensors and Actuators, B: Chemical
Volume	264
DOIs	https://doi.org/10.1016/j.snb.2018.02.147
State	Published - 1 Jul 2018
Externally published	Yes

Keywords

Anisotropic conductive film
Flexible cable
Micro-drive
Microelectrode array
Neural probe

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10.1016/j.snb.2018.02.147

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title = "A novel assembly method for 3-dimensional microelectrode array with micro-drive",

abstract = "This paper reports a novel assembly method for 3-dimensional (3D) microelectrode array with the aid of anisotropic conductive film (ACF). For this purpose, a unique silicon probe with trenches encircled bonding pads was fabricated to realize the ACF-bonding with flexible cable. This design is meaningful because it can realize planar bonding for subsequently convenient 3D stacking and the time-consuming plating is not needed to form bumping on pads. The reliability of the ACF-bonding is demonstrated by measuring the electrochemical impedance spectra (EIS) of the bonded probes with different structural and dimensional bonding pads. The bonded probes are further assembled into 3D arrays and integrated with micro-drive for chronic neural recordings. The excellent recording performance indicates that the ACF-bonded probes are reliable and suitable for chronic neural recordings.",

keywords = "Anisotropic conductive film, Flexible cable, Micro-drive, Microelectrode array, Neural probe",

author = "Wang, {Ming Hao} and Ji, {Bo Wen} and Gu, {Xiao Wei} and Guo, {Zhe Jun} and Wang, {Xiao Lin} and Bin Yang and Li, {Cheng Yu} and Liu, {Jing Quan}",

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doi = "10.1016/j.snb.2018.02.147",

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T1 - A novel assembly method for 3-dimensional microelectrode array with micro-drive

AU - Wang, Ming Hao

AU - Ji, Bo Wen

AU - Gu, Xiao Wei

AU - Guo, Zhe Jun

AU - Wang, Xiao Lin

AU - Yang, Bin

AU - Li, Cheng Yu

AU - Liu, Jing Quan

PY - 2018/7/1

Y1 - 2018/7/1

N2 - This paper reports a novel assembly method for 3-dimensional (3D) microelectrode array with the aid of anisotropic conductive film (ACF). For this purpose, a unique silicon probe with trenches encircled bonding pads was fabricated to realize the ACF-bonding with flexible cable. This design is meaningful because it can realize planar bonding for subsequently convenient 3D stacking and the time-consuming plating is not needed to form bumping on pads. The reliability of the ACF-bonding is demonstrated by measuring the electrochemical impedance spectra (EIS) of the bonded probes with different structural and dimensional bonding pads. The bonded probes are further assembled into 3D arrays and integrated with micro-drive for chronic neural recordings. The excellent recording performance indicates that the ACF-bonded probes are reliable and suitable for chronic neural recordings.

AB - This paper reports a novel assembly method for 3-dimensional (3D) microelectrode array with the aid of anisotropic conductive film (ACF). For this purpose, a unique silicon probe with trenches encircled bonding pads was fabricated to realize the ACF-bonding with flexible cable. This design is meaningful because it can realize planar bonding for subsequently convenient 3D stacking and the time-consuming plating is not needed to form bumping on pads. The reliability of the ACF-bonding is demonstrated by measuring the electrochemical impedance spectra (EIS) of the bonded probes with different structural and dimensional bonding pads. The bonded probes are further assembled into 3D arrays and integrated with micro-drive for chronic neural recordings. The excellent recording performance indicates that the ACF-bonded probes are reliable and suitable for chronic neural recordings.

KW - Anisotropic conductive film

KW - Flexible cable

KW - Micro-drive

KW - Microelectrode array

KW - Neural probe

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EP - 109

JO - Sensors and Actuators, B: Chemical

JF - Sensors and Actuators, B: Chemical

ER -

A novel assembly method for 3-dimensional microelectrode array with micro-drive

Abstract

Keywords

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