TY - GEN
T1 - A new micro slip for analyzing vibration characteristic of dry friction damper under high normal force
AU - He, Shangwen
AU - Ren, Xingmin
AU - Qin, Weiyang
PY - 2010
Y1 - 2010
N2 - In this paper, by introducing elastoplastic shear layer, a new microslip model was presented to analyze dynamic response of system with dry friction damper under high normal force, full stick, paritial slip and full slip stage is considered when dry friction damper vibrates. Based on this model, vibration characteristic of dry friction damper was solved and analyzed by using equivalent linearization and first harmonic balance method. From results, some rules to reduce vibration are found, which can be used to guide damper design.
AB - In this paper, by introducing elastoplastic shear layer, a new microslip model was presented to analyze dynamic response of system with dry friction damper under high normal force, full stick, paritial slip and full slip stage is considered when dry friction damper vibrates. Based on this model, vibration characteristic of dry friction damper was solved and analyzed by using equivalent linearization and first harmonic balance method. From results, some rules to reduce vibration are found, which can be used to guide damper design.
KW - A new microslip model
KW - Dry friction damper
KW - Equivalent linearization
KW - Vibrating characteristic
UR - https://www.scopus.com/pages/publications/77955784922
U2 - 10.1109/ICIC.2010.250
DO - 10.1109/ICIC.2010.250
M3 - 会议稿件
AN - SCOPUS:77955784922
SN - 9780769540474
T3 - ICIC 2010 - 3rd International Conference on Information and Computing
SP - 258
EP - 261
BT - ICIC 2010 - 3rd International Conference on Information and Computing
T2 - 3rd International Conference on Information and Computing, ICIC 2010
Y2 - 4 June 2010 through 6 June 2010
ER -