A damage model based on synchronous change of electrical resistance for solder materials–experimental and theoretical analysis

An integrated model for describe the solder damage is essential for evaluating chip reliability. Measuring solder strain is straightforward and can be readily applied to chip structures. This study introduces a novel approach that combines the changes in solder resistance and resulting strain simultaneously. The resistance and strain of the solder are simultaneously measured at various tensile rates ranging from 0.0001 mm/s to 0.05 mm/s. A quantitative relationship between normalized resistance and plastic strain is proposed, and a corresponding damage model is developed based on experimental analysis. The model integrates electrical resistance, allowing for the characterization of solder damage regardless of shape and volume variations. Both experimental and numerical results demonstrate the potential applicability of revealing the evolution of damage, offering an alternative method for quantifying damage in materials experiencing large deformations and for evaluating chip reliability.