A creep finite element analysis of indentation creep testing in two phase microstructures (particle/matrix- and thin film/substrate-systems)

Z. F. Yue, G. Eggeler, B. Stöckhert

Research output: Contribution to journalArticlepeer-review

41 Scopus citations

Abstract

The present paper explores the possibilities of determining creep parameters for particles in particle/matrix-microstructures and thin films (TFs) in thin film/substrate-systems using indentation creep testing. The results of the finite element creep stress and strain analysis performed in the present study show the potential and the limits of indentation creep testing in this respect. The study provides information on how different combinations of material properties and geometries (dimensions and shapes) affect indentation creep testing of coarse particles and thin films. An inverse finite element procedure is introduced which allows to determine the creep parameters of particles and thin films (assumed to exhibit a Norton law type of creep behavior) on the basis of two indentation creep tests with two indenter geometries.

Original languageEnglish
Pages (from-to)37-56
Number of pages20
JournalComputational Materials Science
Volume21
Issue number1
DOIs
StatePublished - 2001
Externally publishedYes

Keywords

  • Finite element creep stress analysis
  • Indentation creep testing
  • Indentation of creep parameters
  • Indentation rates
  • Particles
  • Thin films

Fingerprint

Dive into the research topics of 'A creep finite element analysis of indentation creep testing in two phase microstructures (particle/matrix- and thin film/substrate-systems)'. Together they form a unique fingerprint.

Cite this