@inproceedings{02b5359b1b97459086fae76e87a3a5a8,
title = "A coupled thermo-electrical finite element analysis of Pb-free solder joints with interfacial crack propagation",
abstract = "A coupled thermo-electrical finite element analysis has been conducted to predict the electrical concentration and joule heating effects on the failure of solder joints under different current densities. The temperature and current density distribution in a solder joint with a crack propagates near the interface of the bulk solder and intermetallic layer has been predicted. The effects of different thermal and electrical conductivities of solder and intermetallic materials on interfacial crack tip temperature are analyzed. Pronounced temperature and electrical current concentration is observed near the crack tip. Although the Pb-free solder is usually regarded has having a higher melting temperature compared with Pb-rich solder, the concentration of heat near the crack tip caused by joule heating may still melt the solder material under high current density. The propagation of crack will be enhanced and cause a circuit failure.",
keywords = "Crack, Electrical current, Finite element, Interface, Joules heating, Solder",
author = "Yao Yao and Keer, \{Leon M.\}",
year = "2010",
language = "英语",
isbn = "9781617820328",
series = "Materials Science and Technology Conference and Exhibition 2010, MS and T'10",
pages = "605--613",
booktitle = "Materials Science and Technology Conference and Exhibition 2010, MS and T'10",
note = "Materials Science and Technology Conference and Exhibition 2010, MS and T'10 ; Conference date: 17-10-2010 Through 21-10-2010",
}