煤基石墨烯改性树脂热界面材料研究进展

With the development of the electronics industry, more and more components are being packed in the electronic device, which has led to challenges in thermal management. Resin matrix thermal interface material, as a kind of heat dispersing materials, plays a role of conducting heat between the surfaces of heat sources and heat sinks and guaranteeing the stability and reliability of electronic devices during operation. Because of its ultrahigh thermal conductivity, graphene has become a new research hotspot for reinforcing heat-conducting property of resin matrix thermal interface materials. The category of resin matrix and graphene filler were introduced. Preparation methods of grapheme resin matrix thermal interface materials were generalized. Based on the status and development, the perspective of graphene/resin matrix thermal interface materials is discussed.