平纹编织SiC/SiC复合材料多尺度建模及强度预测

Translated title of the contribution: Multi-scale modeling and strength prediction of plain woven SiC/SiC composites

Xinyu Hui, Yingjie Xu, Weihong Zhang, Zongbei He

Research output: Contribution to journalArticlepeer-review

17 Scopus citations

Abstract

Continuous SiC fiber reinforced SiC matrix composites (SiC/SiC) have good application prospects in the nuclear engineering structures, due to their excellent high-temperature mechanical properties, irradiation stability and low helium permeability. Understanding the damage evolution mechanism and the strength is significant for the application of SiC/SiC composites. Based on the multi-scale characteristics of the fabrication process and component material distribution of plain woven SiC/SiC composites, fiber-scale (the fiber yarn model) and yarn-scale (the woven fabric model) unit cell models were established considering the local periodicity of the microstructure of the composites. In this paper, finite element method was applied to predict the elastic properties and strength properties of the fiber-scale model, which were then substituted into the yarn-scale model. The Tsai-Wu failure criterion was employed and the stiffness reduction was conducted in the failed elements according to the different failure modes. The progressive damage process of plain woven SiC/SiC composites under uniaxial tensile load was simulated. The numerical simulation curve is in good agreement with the experimental curve, which demonstrates the predictive capability of the proposed method for predicting the strength of plain woven SiC/SiC composites.

Translated title of the contributionMulti-scale modeling and strength prediction of plain woven SiC/SiC composites
Original languageChinese (Traditional)
Pages (from-to)2380-2388
Number of pages9
JournalFuhe Cailiao Xuebao/Acta Materiae Compositae Sinica
Volume36
Issue number10
DOIs
StatePublished - 1 Oct 2019

Fingerprint

Dive into the research topics of 'Multi-scale modeling and strength prediction of plain woven SiC/SiC composites'. Together they form a unique fingerprint.

Cite this