功率模块主动热控制技术研究综述

Power semiconductor devices are the core of electric energy conversion and electric drive based on the power electronics technology, which have broad application prospects in new energy generation, transportation, aerospace and other fields. However, the problems such as degradation, failure and reliability caused by heat generation have become bottlenecks that limit their further development, and it is urgent to explore effective thermal management methods to improve their reliability and service life. In this paper, based on the introduction of thermal management methods for power modules, the research progress in active thermal management methods is reviewed in detail, and these methods are divided into device-level, system-level and multi-parameter comprehensive methods according to the difference in control parameters. In addition, various methods are analyzed and compared. Finally, the development trend and prospect of technologies for power devices which are related to junction temperature are put forward, providing a reference for the subsequent research and applications.